該設備用于將晶圓保護膠帶貼合在晶圓表面,以防止在B/G站晶圓電路加工過程中損壞。
設備特點:
? Easy operation and maintenance by soft were are calibration.
軟件標準,操作方便,維護方便
? 6~8 inch and 8~12 inch wafer capability.
6- 8英寸和8~12英寸晶圓能力
? Tape capable of normal and UV tape.
可滿足普通膠帶和UV膠帶
? High accuracy lamination by pre-aligner.
高精度貼合
? Air bubble free lamination.
無氣泡分層
? Adjustable cutting blade angle.
切割刀片角度可調
? Precision edge cutting for optimum wafer backgrounding.
精確的邊緣切割,滿足最佳的圓片研磨
? No tape burrand tail after lamination.
覆膜后無帶毛刺和帶尾
? Minimum tape consumption.
最小的膠帶損耗
? Easy tape setting by onetouch locker.
一鍵鎖止裝置輕松設置膠帶
? High precise robotic handler.
高精度自動機械臂
? Quick and easy conversion for different size wafer.
快速和簡單的轉換,不同尺寸的晶圓
? Capable of Bumping wafer by special bond roller.
可通過特殊的粘接滾筒進行壓片